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[IEEE 28th International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (16-18 July 2003)] IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. - BMI resins as low-stress alternatives to epoxies for semiconductor package assembly
Perabo, C.Year:
2003
Language:
english
DOI:
10.1109/iemt.2003.1225912
File:
PDF, 441 KB
english, 2003