[IEEE 2013 IEEE International 3D Systems Integration...

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[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Faulty TSVs identification and recovery in 3D stacked ICs during pre-bond testing

Roy, Surajit Kumar, Chatterjee, Sobitri, Giri, Chandan, Rahaman, Hafizur
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Year:
2013
Language:
english
DOI:
10.1109/3DIC.2013.6702339
File:
PDF, 116 KB
english, 2013
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