[IEEE 2005 6th International Conference on Electronics...

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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging

Jian Cai,, Qian Wang,, Xiaogang Li,, Woonbae Kim,, Shuidi Wang,, Junsik Hwang,, Changyoul Moon,
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Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564660
File:
PDF, 537 KB
english, 2005
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