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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Intermetallics formation and evolution in pure indium joint for cryogenic application
Cheng, X., Liu, C., Silberschmidt, V.V.Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416484
File:
PDF, 6.08 MB
english, 2009