Electronic packaging solder joint reliablity assessment...

IEEE Transactions on Components and Packaging Technologies 2006 / 03 Vol. 29; Iss. 1

Electronic packaging solder joint reliablity assessment with a mechanics-based StrainGage methodology

Mercado, L.L., Hsieh, G., Girouard, S.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848583
Date:
March, 2006
File:
PDF, 810 KB
english, 2006
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