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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Adapted assembly processes for flip-chip technology with solder bumps of 50 µm or 40 µm diameter
Dohle, Rainer, Schussler, Florian, Friedrich, Thomas, Gossler, Jorg, Oppert, Thomas, Franke, JorgYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5643014
File:
PDF, 2.32 MB
english, 2010