Predictive Model for Optimized Design Parameters in...

IEEE Transactions on Components and Packaging Technologies 2007 / 06 Vol. 30; Iss. 2

Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies

Park, Seungbae, Lee, H. C., Sammakia, Bahgat, Raghunathan, Karthik
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.898363
Date:
June, 2007
File:
PDF, 869 KB
english, 2007
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