![](/img/cover-not-exists.png)
Microstructural development during fatigue of copper foils 20–100 μm thick
M. Judelewicz, H.U. Künzi, N. Merk, B. IlschnerVolume:
186
Year:
1994
Language:
english
Pages:
8
DOI:
10.1016/0921-5093(94)90312-3
File:
PDF, 1.47 MB
english, 1994