[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Improved monitoring of ultrasonic wire bonding via input electrical impedance
Dong Zhang,, Shih-Fu Ling,, Sung Yi,, Say Wee Foo,Year:
2004
Language:
english
DOI:
10.1109/eptc.2004.1396634
File:
PDF, 357 KB
english, 2004