Electromigration-induced void grain-boundary interactions:...

Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures

Ogurtani, Tarik Omer, Oren, Ersin Emre
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
96
Year:
2004
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.1815389
File:
PDF, 521 KB
english, 2004
Conversion to is in progress
Conversion to is failed