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Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures
Ogurtani, Tarik Omer, Oren, Ersin EmreVolume:
96
Year:
2004
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.1815389
File:
PDF, 521 KB
english, 2004