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[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Chip-package-board co-design for complex System-on-Chip (SoC)
Patil, Mahendrasing, Brahme, Amit, Shust, Michael, Coates, Keven, Thatte, Shubhada, Soman, Sreekanth, Kumar, KamalYear:
2010
Language:
english
DOI:
10.1109/edaps.2010.5683017
File:
PDF, 828 KB
english, 2010