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[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Pre-develop bake for end point stabilization with photo-BCB polymers
Scheck, D., Rogers, B., Garrou, P., Dibbs, M., Strandjord, A., Cummings, S., Ida, Y.Year:
1998
Language:
english
DOI:
10.1109/isapm.1998.664439
File:
PDF, 419 KB
english, 1998