On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part II: Molding Compound
Alpern, P., Nelle, P., Barti, E., Gunther, H., Kessler, A., Tilgner, R., Stecher, M.Volume:
9
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2009.2018655
Date:
June, 2009
File:
PDF, 1.36 MB
english, 2009