Study of shallow silicon trench etch process using planar...

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films 1997 / 5 Vol. 15; Iss. 3

Study of shallow silicon trench etch process using planar inductively coupled plasmas

Lee, Ju-Hoon
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Volume:
15
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.580686
Date:
May, 1997
File:
PDF, 2.11 MB
english, 1997
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