A footprint study of bond initiation in gold wire crescent...

A footprint study of bond initiation in gold wire crescent bonding

Zhou, Y., Li, X., Noolu, N.J.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848585
Date:
December, 2005
File:
PDF, 4.98 MB
english, 2005
Conversion to is in progress
Conversion to is failed