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A footprint study of bond initiation in gold wire crescent bonding
Zhou, Y., Li, X., Noolu, N.J.Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848585
Date:
December, 2005
File:
PDF, 4.98 MB
english, 2005