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Processing and reliability of fast-flow, snap-cure underfills - Part I: processing and moisture sensitivity
Baldwin, D.F., Houston, P.N., Deladisma, M., Crane, L.N., Konarski, M.M.Volume:
23
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2000.895055
Date:
October, 2000
File:
PDF, 14 KB
english, 2000