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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages
Cauchois, Romain, Saadaoui, Mohamed, Legeleux, Jacques, Malia, Thierry, Dubois-Bonvalot, Beatrice, Inal, Karim, Fidalgo, Jean-ChristopheYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642997
File:
PDF, 1.77 MB
english, 2010