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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Supercritical CO/sub 2/ for ULK/Cu integration
Danel, A., Millet, C., Perrut, V., Daviot, J., Jousseaume, V., Louveau, O., Louis, D.Year:
2003
Language:
english
DOI:
10.1109/iitc.2003.1219767
File:
PDF, 240 KB
english, 2003