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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Reliability of Au-Ag alloy wire bonding
Liu, Hai, Chen, Qi, Zhao, Zhenqing, Wang, Qian, Zeng, Jianfeng, Chae, Jonghyun, Lee, JaisungYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490906
File:
PDF, 1.03 MB
english, 2010