[IEEE 2010 Proceedings 60th Electronic Components and...

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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effects of material properties on PoP top package warpage behaviors

Yim, Myung Jin, Strode, Richard, Adimula, Ravikumar, Yoo, Chan
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Year:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490834
File:
PDF, 781 KB
english, 2010
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