Evaluation of radio-frequency sputter-deposited textured TiN thin films as diffusion barriers between copper and silicon
Chen, G. S., Guo, J. J., Lin, C. K., Hsu, Chen-Sheng, Yang, L. C., Fang, J. S.Volume:
20
Year:
2002
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.1450580
File:
PDF, 862 KB
english, 2002