Modeling and Analyzing High-Speed and High-Density...

IEEE Transactions on Advanced Packaging 2008 / 02 Vol. 31; Iss. 1

Modeling and Analyzing High-Speed and High-Density Connectors by Using Multisegment Multiple Transmission Lines Model

Mu-Shui Zhang,, Yu-Shan Li,, Li-Ping Li,, Chen Jia,
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2007.908029
Date:
February, 2008
File:
PDF, 961 KB
english, 2008
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