Flow rate rule for high aspect ratio SiO[sub 2] hole etching
Chinzei, YasuhikoVolume:
16
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.581180
Date:
May, 1998
File:
PDF, 514 KB
english, 1998