[IEEE 2009 IEEE 59th Electronic Components and Technology...

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - A novel method to predict die shift during compression molding in embedded wafer level package

Chee Houe Khong,, Kumar, Aditya, Xiaowu Zhang,, Sharma, Gaurav, Vempati, Srinivasa Rao, Vaidyanathan, Kripesh, Lau, John Hon-Shing, Dim-Lee Kwong,

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Year:

2009

Language:

english

DOI:

10.1109/ectc.2009.5074066

File:

PDF, 2.55 MB

english, 2009

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