[IEEE 2013 IEEE International Symposium on Electromagnetic...

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[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - System level simulation solutions for high-speed channels - Package and PCB interface

Zhang, Jianmin, Scogna, Antonio Ciccomancini, Vincent, Tracey, Shi, Hong, Liu, Hui
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Year:
2013
Language:
english
DOI:
10.1109/isemc.2013.6670481
File:
PDF, 1.08 MB
english, 2013
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