Measurement of strain in Al–Cu interconnect lines with...

Journal of Applied Physics 1999 Vol. 86; Iss. 2

Measurement of strain in Al–Cu interconnect lines with x-ray microdiffraction

Solak, H. H., Vladimirsky, Y., Cerrina, F., Lai, B., Yun, W., Cai, Z., Ilinski, P., Legnini, D., Rodrigues, W.
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Volume:
86
Year:
1999
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.370819
File:
PDF, 443 KB
english, 1999
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