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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Growth behaviour of gold-aluminum intermetallic phases (IMP) in temperature aged ball bonds observed by electron backscatter diffraction
Marz, Benjamin, Scheibe, Stefan, Graff, Andreas, Petzold, MatthiasYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642845
File:
PDF, 3.69 MB
english, 2010