Copper ion transport induced dielectric failure: Inclusion...

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films 2008 Vol. 26; Iss. 6

Copper ion transport induced dielectric failure: Inclusion of elastic drift and consequences for reliability

Achanta, Ravi S., Plawsky, Joel L., Gill, William N.
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Volume:
26
Year:
2008
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.2998808
File:
PDF, 430 KB
english, 2008
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