Methods of analysing thermomechanical stress in plastic...

Journal of Materials Processing Technology 1995 Vol. 54; Iss. 1-4

Methods of analysing thermomechanical stress in plastic packages for integrated circuits

O. Slattery, T. Hayes, W. Lawton, G. Kelly, C. Lyden, J. Barrett, C. O'Mathuna
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Volume:
54
Year:
1995
Language:
english
Pages:
6
DOI:
10.1016/0924-0136(95)01942-1
File:
PDF, 622 KB
english, 1995
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