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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Underfill optimization under accelerated temperature cycling and drop-impact loading for stacked packages using finite element modeling
Schneck, Nathan, Johnson, ZaneYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074070
File:
PDF, 1.04 MB
english, 2009