[IEEE IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (7-11 July 2003)] Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 - Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
Ratchev, P., Vandevelde, B., De Wolf, I.Year:
2003
Language:
english
DOI:
10.1109/ipfa.2003.1222749
File:
PDF, 391 KB
english, 2003