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Finite-element analysis of thermal stresses in a silicon pressure sensor for various die-mount materials
Yu-Cheng Lin, Peter J. Hesketh, John P. SchusterVolume:
44
Year:
1994
Language:
english
Pages:
5
DOI:
10.1016/0924-4247(94)00811-6
File:
PDF, 458 KB
english, 1994