Finite-element analysis of thermal stresses in a silicon...

Finite-element analysis of thermal stresses in a silicon pressure sensor for various die-mount materials

Yu-Cheng Lin, Peter J. Hesketh, John P. Schuster
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
44
Year:
1994
Language:
english
Pages:
5
DOI:
10.1016/0924-4247(94)00811-6
File:
PDF, 458 KB
english, 1994
Conversion to is in progress
Conversion to is failed