Assembling three-dimensional microstructures using gold-silicon eutectic bonding
A.-L. Tiensuu, M. Bexell, J.-Å. Schweitz, L. Smith, S. JohnssonVolume:
45
Year:
1994
Language:
english
Pages:
10
DOI:
10.1016/0924-4247(94)00836-1
File:
PDF, 3.35 MB
english, 1994