Process development and bonding quality investigations of silicon layer stacking based on copper wafer bonding
Chen, K. N., Chang, S. M., Fan, A., Tan, C. S., Shen, L. C., Reif, R.Volume:
87
Year:
2005
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.1995943
File:
PDF, 526 KB
english, 2005