![](/img/cover-not-exists.png)
[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Mold process development of C90 LowK and ultra-finepitch BGA for robust reliability performance
Ibrahim, Ruzaini, Low, Boon-Yew, Poh, Zi-SongYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416522
File:
PDF, 601 KB
english, 2009