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Electromigration-induced drift in damascene and plasma-etched Al(Cu). I. Kinetics of Cu depletion in polycrystalline interconnects
Proost, Joris, Witvrouw, Ann, Maex, Karen, D’Haen, Jan, Cosemans, PatrickVolume:
87
Year:
2000
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.371830
File:
PDF, 824 KB
english, 2000