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[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Package reliability related to die surface passivation: Characterization through TOF-SIMS analysis and package stressing
Eu Poh Leng,Year:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702684
File:
PDF, 1.25 MB
english, 2010