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[IEEE 2009 IEEE MTT-S International Microwave Symposium Digest (MTT) - Boston, MA, USA (2009.06.7-2009.06.12)] 2009 IEEE MTT-S International Microwave Symposium Digest - A wafer-level diamond bonding process to improve power handling capability of submillimeter-wave Schottky diode frequency multipliers
Lee, C., Ward, J., Lin, R., Schlecht, E., Chattopadhyay, G., Gill, J., Thomas, B., Maestrini, A., Mehdi, I., Siegel, P.Year:
2009
Language:
english
DOI:
10.1109/mwsym.2009.5165857
File:
PDF, 606 KB
english, 2009