![](/img/cover-not-exists.png)
[IEEE 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2013) - Chenzhen, China (2013.10.20-2013.10.23)] 2013 Annual Report Conference on Electrical Insulation and Dielectric Phenomena - Temperature-dependence of dielectric properties for copper clad laminate used in integrated power module
Huiyu, Hu, Lisheng, Zhong, Qinxue, Yu, Jinghui, Gao, Tieyu, ZhaoYear:
2013
Language:
english
DOI:
10.1109/ceidp.2013.6747462
File:
PDF, 299 KB
english, 2013