Low-cost, multi-GHz electrical packaging for serial...

IEEE Transactions on Advanced Packaging 2000 / Feb. Vol. 23; Iss. 1

Low-cost, multi-GHz electrical packaging for serial optoelectronic links utilizing vertical cavity surface emitting lasers

Fokken, G.J., Walters, W.L., Mattson, L.F., Gilbert, B.K.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.826761
Date:
January, 2000
File:
PDF, 3.95 MB
english, 2000
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