Interdiffusion of high-Sn/high-Pb (SnPb) solders in...

Applied Physics Letters 1999 Vol. 75; Iss. 23

Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow

Zuruzi, A. S., Chiu, C.-h., Chen, W. T., Lahiri, S. K., Tu, K. N.
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Volume:
75
Year:
1999
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.125412
File:
PDF, 590 KB
english, 1999
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