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Adhesion improvement of thermoplastic-based isotropic conductive adhesives under humid environment using self-assembled monolayer compounds
Moon, Kyoung-Sik, Rockett, Chris, Wong, C. P.Volume:
18
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856104772759377
Date:
January, 2004
File:
PDF, 648 KB
english, 2004