![](/img/cover-not-exists.png)
[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Modeling and analysis of electrothermal effects on global ULSI interconnects
Li, Xiaochun, Tong, Jialing, Shao, Yan, Mao, JunfaYear:
2010
Language:
english
DOI:
10.1109/edaps.2010.5683036
File:
PDF, 287 KB
english, 2010