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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Isotropically conductive adhesives filled with copper nanoparticles and micron-sized flakes
Chen, Wenjun, Deng, Dunying, Xiao, FeiYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922654
File:
PDF, 613 KB
english, 2014