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PATTERNED COPPER PLATING LAYER THICKNESS MADE UNIFORM BY PLACEMENT OF AUXILIARY GRID ELECTRODE ABOUT BALL GRID ARRAYS
Okubo, Toshikazu, Kodera, Tamie, Kondo, KazuoVolume:
193
Language:
english
Journal:
Chemical Engineering Communications
DOI:
10.1080/00986440600584052
Date:
December, 2006
File:
PDF, 1.80 MB
english, 2006