PATTERNED COPPER PLATING LAYER THICKNESS MADE UNIFORM BY...

PATTERNED COPPER PLATING LAYER THICKNESS MADE UNIFORM BY PLACEMENT OF AUXILIARY GRID ELECTRODE ABOUT BALL GRID ARRAYS

Okubo, Toshikazu, Kodera, Tamie, Kondo, Kazuo
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Volume:
193
Language:
english
Journal:
Chemical Engineering Communications
DOI:
10.1080/00986440600584052
Date:
December, 2006
File:
PDF, 1.80 MB
english, 2006
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