![](/img/cover-not-exists.png)
Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces
Ogurtani, Tarik Omer, Akyildiz, OncuVolume:
97
Year:
2005
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.1883305
File:
PDF, 377 KB
english, 2005