Flip chip interconnect systems using copper wire stud bump...

IEEE Transactions on Electronics Packaging Manufacturing 2001 / 10 Vol. 24; Iss. 4

Flip chip interconnect systems using copper wire stud bump and lead free solder

Zama, S., Baldwin, D.F., Hikami, T., Murata, H.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
24
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.980034
Date:
October, 2001
File:
PDF, 153 KB
english, 2001
Conversion to is in progress
Conversion to is failed