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Flip chip interconnect systems using copper wire stud bump and lead free solder
Zama, S., Baldwin, D.F., Hikami, T., Murata, H.Volume:
24
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.980034
Date:
October, 2001
File:
PDF, 153 KB
english, 2001