![](/img/cover-not-exists.png)
[IEEE 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Galati, Romania (2013.10.24-2013.10.27)] 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Factors influencing the formation of voids in chip component solder joints
Pantazica, Mihaela, Svasta, Paul, Wohlrabe, Heinz, Wolter, Klaus-JurgenYear:
2013
Language:
english
DOI:
10.1109/siitme.2013.6743690
File:
PDF, 1.77 MB
english, 2013