Molecular Modeling and Multiscaling Issues for Electronic...

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Molecular Modeling and Multiscaling Issues for Electronic Material Applications || Using Coarse-Grained Molecular Models (Molecular-Mesoscale) of a Copper Oxide-Epoxy Interface to Obtain Stress–Strain Failure Predictions Which Include Interfacial Roughness, Water and Filler Effects

Wymyslowski, Artur, Iwamoto, Nancy, Yuen, Matthew, Fan, Haibo
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Volume:
10.1007/97
Year:
2015
Language:
english
DOI:
10.1007/978-3-319-12862-7_6
File:
PDF, 3.33 MB
english, 2015
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