Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems
Se-Young Jang,, Kyung Wook Paik,Volume:
24
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.980035
Date:
October, 2001
File:
PDF, 168 KB
english, 2001